The upcoming development kit has the following planned features.
- New correlator board with Spartan 6 FPGA. This will remove the interposer board that can get damaged during shipping. The previous correlator had parts that were no longer in production and were getting difficult to get.
- Motherboard V3.1. Same as previous version.
- Radio Board 3.01b1. Same as previous version.
- Case: New power connector - we’re moving away from barrel connectors to a proper waterproof IP68 power connector that is secure (won’t fall out).
I’ll update this thread as the correlator design progresses. As usual kits will be available through the Electronics Research Foundation.
Tim
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